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21 points jsheard | 2 comments | | HN request time: 0.383s | source
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jack_tripper ◴[] No.46244065[source]
The most important part of this news article:

  "TechInsights has confirmed that SMIC's N+3 node, despite achieving impressive DUV multi-patterning implementation, encounters significant yield challenges, particularly due to the aggressively scaled metal pitch.

  As a result, the Huawei Kirin 9030 SoC is likely produced at an operating loss, with a significant portion of dies being discarded or used for downgraded chips."
So TSMC and friends have nothing to worry about (yet) since SMIC long hit the physical limits on what's possible to shrink using DUV.

However that's probably more than enough to ensure chips for China's strategic national security and defense needs.

replies(1): >>46244173 #
1. sidewndr46 ◴[] No.46244173[source]
Thanks, this was my theory as well when I read the title. The production is entirely possible, but the yield is useless.
replies(1): >>46244197 #
2. jack_tripper ◴[] No.46244197[source]
Depends on what you classify as useless.

They aren't making any laptops or smartphones, but Russia has no problem demolishing Ukraine using weapons powered by domestic 160nm-350nm chips and vacuum tubes.

So 5nm should be more than enough for cutting edge defense applications.