The most important part of this news article:
"TechInsights has confirmed that SMIC's N+3 node, despite achieving impressive DUV multi-patterning implementation, encounters significant yield challenges, particularly due to the aggressively scaled metal pitch.
As a result, the Huawei Kirin 9030 SoC is likely produced at an operating loss, with a significant portion of dies being discarded or used for downgraded chips."
So TSMC and friends have nothing to worry about (yet) since SMIC long hit the physical limits on what's possible to shrink using DUV.However that's probably more than enough to ensure chips for China's strategic national security and defense needs.
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