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200 points rbanffy | 1 comments | | HN request time: 0.208s | source
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_factor ◴[] No.45655809[source]
“If our work continues to succeed as it has, heat will become a far less onerous constraint in CMOS and other electronics too.”

When it matures, you’re right back to the same heat constraint considerations, just with faster chips.

replies(3): >>45658349 #>>45663037 #>>45663545 #
1. stavros ◴[] No.45663037[source]
"Diamond substrate breakthrough enables faster chips."