Diamond Thermal Conductivity: A New Era in Chip Cooling

“If our work continues to succeed as it has, heat will become a far less onerous constraint in CMOS and other electronics too.”

When it matures, you’re right back to the same heat constraint considerations, just with faster chips.

So? You're always going to hit some constraint. Such is the nature of physical reality after all. Advances in the field are all about pushing past the current blockers to the next ones.

"Diamond substrate breakthrough enables faster chips."