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199 points angadh | 2 comments | | HN request time: 0s | source
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perihelions ◴[] No.44396017[source]
I wonder if there could be some way to photolitograph compute circuits directly onto a radiator substrate, and accomplish a fully-passive thermal solution that way. Consider the heat-conduction problem: from dimensional analysis, the required thickness of a (conduction-only) radiator plate with a regular grid of heat sources on it shrinks superlinearly as you subdivide those heat sources (from few large sources, into many, small ones). At fixed areal power density, if the unit heat source is Q, the plate thickness d ∝ Q^{-3/2}. (This is intuitive: the asymptotic limit is a uniform, continuous heat source exactly matched to a uniform radiation heat sink; hence heat conduction is zero). So: could one contemplate an array of very tiny CPU sub-units, grided evenly over a thin Al foil—say at the milliwatt scale with millimeter-scale separation? It'd be mostly empty space (radiator area) and interconnect. It'd be thermally self-sufficient and weigh practically nothing.
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api ◴[] No.44396060[source]
Look at the thermal shield design for the JWST. Could you have a data center that unfolds into a multi-layered plane where the outer solar collector layer faces the sun, an intermediate layer shields infrared emissions from the back side of that, and the final layer that always faces away from the sun holds (or is) a bunch of chips? Park it in an orbit where it can stay oriented this way or an L point. Free compute for the life span of the chips powered by the sun.

A lot of these is a supercomputing Dyson swarm.

Also do chips in space need casing or could the wafers be just exposed on that back layer?

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1. dumah ◴[] No.44400273[source]
Radiation at desirable operating temperatures is a relatively weak means of heat transport, hence spreaders.

Only a big power-efficient chip like M2 Ultra could survive if it could _only_ radiate from one side of the wafer into CMB.

The rest of the silicon will become molten at 100% TDP: H100, Xeon, Core, EPYC, Ryzen.

Most would be over 400C at 1% TDP.

Conduction and convection are linear or close and are effective at desirable temperatures, whereas thermal radiation is quartic and highly convex.

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2. api ◴[] No.44405355[source]
Makes space based data centers sound impractical.

I recall some sci fi like The Expanse where it’s mentioned as an aside that big industrial processes happen on asteroids or moons because you can use a big cold rock as a heat sink.