(spectrum.ieee.org)

200 points rbanffy | 1 comments | 21 Oct 25 11:16 UTC | HN request time: 0.308s | source

1. Animats ◴[22 Oct 25 04:09 UTC] No.45664810[source]▶

Ah, inside the chip. Diamond heat spreaders outside the chip are known.[1]

Next, a diamond layer every few layers in 3D chips?

Diamond Thermal Conductivity: A New Era in Chip Cooling