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Diamond Thermal Conductivity: A New Era in Chip Cooling

(spectrum.ieee.org)
200 points rbanffy | 1 comments | 21 Oct 25 11:16 UTC | HN request time: 0.217s | source
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modeless ◴[21 Oct 25 14:27 UTC] No.45656267[source]▶
If this can enable practically unlimited 3D stacking of CMOS layers, it could be hugely consequential for computing.

On an unrelated note, I like the writing style of this article a lot. This is how science journalism should be. It reminds me of how Scientific American used to be before it was ruined. Is IEEE Spectrum always like this? I might have to subscribe to the print version. I want articles like this floating around my house for my kids to discover.

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jovial_cavalier ◴[21 Oct 25 15:37 UTC] No.45657113[source]▶
Spectrum is typically pretty good, but this article definitely stands out as very well written. I'm guessing that's because it's written by an actual contributor to the research. Nothing beats when those guys can actually unpack an idea simply.
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1. ftcHn ◴[21 Oct 25 22:13 UTC] No.45662396[source]▶
Great science communication. This is another really good Spectrum article that was on HN a while back.

The Tiny Star Explosions Powering Moore’s Law https://spectrum.ieee.org/euv-light-source