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Diamond Thermal Conductivity: A New Era in Chip Cooling

(spectrum.ieee.org)
200 points rbanffy | 1 comments | 21 Oct 25 11:16 UTC | HN request time: 0.274s | source
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modeless ◴[21 Oct 25 14:27 UTC] No.45656267[source]▶
If this can enable practically unlimited 3D stacking of CMOS layers, it could be hugely consequential for computing.

On an unrelated note, I like the writing style of this article a lot. This is how science journalism should be. It reminds me of how Scientific American used to be before it was ruined. Is IEEE Spectrum always like this? I might have to subscribe to the print version. I want articles like this floating around my house for my kids to discover.

replies(2): >>45657113 #>>45658023 #
1. kens ◴[21 Oct 25 16:47 UTC] No.45658023[source]▶
The editors at IEEE Spectrum are very good at improving articles. They also thoroughly fact-check articles. (Source: I wrote a couple of articles for IEEE Spectrum.)