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Nano-engineered thermoelectrics enable scalable, compressor-free cooling

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119 points mcswell | 2 comments | 30 Jun 25 14:51 UTC | HN request time: 0.423s | source
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fnordpiglet ◴[03 Jul 25 02:52 UTC] No.44451185[source]▶
Thermoelectric cooling needs as much research as possible. Mechanical cooling is extraordinarily space consuming. CHESS has the potential over the next 10 years to largely replace vapor compression in most systems other than the most extreme gradients or scales. They are small enough to incorporate into most devices and would allow smaller devices more thermal load. In some ways I think efficient TEC like CHESS could be more useful than room temperature super conductors.
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1. dartharva ◴[03 Jul 25 14:21 UTC] No.44455344[source]▶
Wait, won't thermoelectric cooling need a LOT more surface area to have any comparable cooling performance to compressor-based systems?
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2. fnordpiglet ◴[06 Jul 25 12:55 UTC] No.44480426[source]▶
You can manifold CHESS TEC into curved surfaces and cool / heat gyroid / honeycomb manifolds of copper with conducting surfaces. You can also simply stack them. The curving reduces efficiency a bit - not much. Regardless there are ways to increase the surfaces area and volume cooled / heated significantly and improve efficiency through different geometries and configurations.