what exactly do you expect them to do about the routing? 384b gpus are as big as memory buses get in the modern era and that gives you 24gb capacity or 48gb when clamshelled. Higher-density 3GB modules that would allow 36GB/72GB have been repeatedly pushed back, which has kinda screwed over consoles as well - they are in the same bind with "insufficient" VRAM on MS and while sony is less awful they didn't give a VRAM increase with PS5 Pro either.
GB202 might be going to 512b bus which is unprecedented in the modern era (nobody has done it since the Hawaii/GCN2 days) but that's really as big as anybody cares to route right now. What do you propose for going past that?
Ironically AMD actually does have the capability to experiment and put bigger memory buses on smaller dies. And the MCM packaging actually does give you some physical fanout that makes the routing easier. But again, ultimately there is just no appetite for going to 512b or 768b buses at a design level, for very good technical reasons.
like it just is what it is - GDDR is just not very dense, this is what you can get out of it. Production of HBM-based gpus is constrained by stacking capacity, which is the same reason people can't get enough datacenter cards in the first place.
Higher-density LPDDR does exist, but you still have to route it, and bandwidth goes down quite a bit. And that's the Apple Silicon approach, which solves your problem but unfortunately a lot of people just flatly reject any offering from the Fruit Company for interpersonal reasons.